DocumentCode
2345248
Title
New developments at AT&S in the area of advanced materials for printed wiring boards
Author
Krziwanek, Thomas M.
Author_Institution
Ind. Sci. & Technol. Dept., AT&S AG, Leoben, Austria
fYear
2002
fDate
2002
Firstpage
342
Lastpage
347
Abstract
The fast and ongoing development in the electronic market raises demands for new solutions in the area of base-materials for printed wiring boards. Today´s key issues are price, reliability, advanced design rules, thermal properties as well as environmental issues. These driving forces have started an intensive investigation process resulting in a big variety of newly developed materials with unique and highly specialised properties
Keywords
printed circuit manufacture; base material; printed wiring board; Dielectric materials; Drilling; Electronics industry; Laser modes; Materials reliability; Optical materials; Radio frequency; Radio spectrum management; Thermal management; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials, 2002. Proceedings. 2002 8th International Symposium on
Conference_Location
Stone Mountain, GA
Print_ISBN
0-7803-7434-7
Type
conf
DOI
10.1109/ISAPM.2002.990409
Filename
990409
Link To Document