DocumentCode
2348231
Title
Embedded MRAM for high-speed computing
Author
Zhao, W.S. ; Zhang, Y. ; Lakys, Y. ; Klein, J.-O. ; Etiemble, D. ; Revelosona, D. ; Chappert, C. ; Torres, L. ; Cargnini, L.V. ; Brum, R.M. ; Guillemenet, Y. ; Sassatelli, G.
Author_Institution
IEF, Univ. Paris-Sud 11, Orsay, France
fYear
2011
fDate
3-5 Oct. 2011
Firstpage
37
Lastpage
42
Abstract
As the fabrication technology node shrinks down to 90nm or below, high standby power becomes one of the major critical issues for CMOS high-speed computing circuits (e.g. logic and cache memory) due to the high leakage currents. A number of non-volatile storage technologies such as FeRAM, MRAM, PCRAM and RRAM and so on, are under investigation to bring the non-volatility into the logic circuits and then eliminate completely the standby power issue. Thanks to its infinite endurance, high switching/sensing speed and easy 3D integration after CMOS process, MRAM is considered as the most promising one. Numerous logic circuits based on MRAM technology have been proposed and prototyped in the last years. In this paper, we present an overview and current status of these logic circuits and discuss their potential applications in the future from both the physics and architecture points of view.
Keywords
CMOS integrated circuits; logic circuits; random-access storage; CMOS high-speed computing circuits; FeRAM; PCRAM; RRAM; embedded MRAM; fabrication technology; leakage currents; logic circuits; nonvolatile storage technologies; Computer architecture; Field programmable gate arrays; Logic circuits; Magnetic circuits; Magnetic tunneling; Random access memory; Switches; 3D integration; Cache Memory; Embedded MRAM; Flip-Flop; Magnetic logic; Memory-in-logic; Non-Volatile;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI and System-on-Chip (VLSI-SoC), 2011 IEEE/IFIP 19th International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4577-0171-9
Electronic_ISBN
978-1-4577-0169-6
Type
conf
DOI
10.1109/VLSISoC.2011.6081627
Filename
6081627
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