DocumentCode
2348868
Title
4D-5 BAW Technologies: Development and Applications within MARTINA, MIMOSA and MOBILIS IST European Projects (Invited)
Author
Kerherve, E. ; Ancey, P. ; Aid, M. ; Kaiser, A.
Author_Institution
IXL Lab., Bordeaux Univ.
fYear
2006
fDate
2-6 Oct. 2006
Firstpage
341
Lastpage
350
Abstract
The paper presents recent results obtained with FBAR and SMR BAW resonators for radiofrequency microelectronics applications within three European projects. The design and implementation of an RF front-end for WCDMA applications using an above-IC BAW band-pass filter is reported (SoC integration) from MARTINA European project. The second European project (MIMOSA) proposes a SiP integration to make an ISM-band wake-up radio receiver using a selective low-noise amplifier (LNA). The selectivity is assured by a SMR-type BAW bandpass filter. The CMOS IC chip and the BAW filter are connected together by wire-bonding or by flip-chipping. The objective of the third European project (MOBILIS) is to develop a robust and cost-effective integrated high-power RF filtering technology and demonstrate the feasibility of a mixed SoC (nanometric CMOS/system integration) and SiP (BiCMOS/power-BAW) RF power transmitter. The targeted transmitter is based on a digital radio transmitter architecture and addresses both the WCDMA and DCS standards. Finally, some solutions are proposed to address the BAW technology future challenges in terms of high frequency applications (> 10 GHz), multi-standard reconfigurability, one-chip radio and combined ladder-stage with lattice stage
Keywords
acoustic resonators; band-pass filters; bulk acoustic wave devices; radiofrequency integrated circuits; surface mount technology; BAW technology; BiCMOS-power-BAW; CMOS IC chip; DCS standards; FBAR resonators; ISM-band wake-up radio receiver; MARTINA European project; MIMOSA European project; MOBILIS IST European project; RF filtering technology; RF power transmitter; SMR BAW resonators; SMR-type BAW bandpass filter; SiP integration; SoC integration; WCDMA applications; WCDMA standards; above-IC BAW band-pass filter; bulk acoustic wave; digital radio transmitter architecture; film bulk acoustic resonator; flip-chipping; ladder-stage-lattice stage combination; low-noise amplifier; multistandard reconfigurability; nanometric CMOS-system integration; one-chip radio; radiofrequency microelectronics; solidly mounted resonator; system-in-package; system-on-chip; wideband code division multiple access; wire-bonding; Band pass filters; CMOS integrated circuits; CMOS technology; Film bulk acoustic resonators; Low-noise amplifiers; Microelectronics; Multiaccess communication; Radio frequency; Radio transmitters; Receivers;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2006. IEEE
Conference_Location
Vancouver, BC
ISSN
1051-0117
Print_ISBN
1-4244-0201-8
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2006.101
Filename
4151957
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