DocumentCode
2349280
Title
Simulation and characterization of electronic packages
Author
Lee, Andy ; Sen, Bidyut ; Tahmassebi, Shawn
Author_Institution
SiliconGraphics Inc.
fYear
1994
fDate
1994
Keywords
Art; Electronic packaging thermal management; Electronics packaging; Finite element methods; Plastic packaging; Power measurement; Power system modeling; Rapid thermal processing; Software packages; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Materials Symposium, 1994. EDMS 1994. 1994 International
Type
conf
DOI
10.1109/EDMS.1994.863876
Filename
863876
Link To Document