First demonstration of a surface mountable, ultra-thin glass BGA package for smart mobile logic devices

This paper presents the first demonstration of an ultra-thin glass BGA package that is assembled on to mother board with standard SMT technology. Such a package has many new advances that include ultra-thin glass, high speed through via hole formation and copper metallization, double-side RDL wiring with advanced 3 micron ground rules, and Cu-SnAg microbump assembly of a 10mm silicon test die. Glass, as a package, overcomes the shortcomings of organic packages in bump pitch, CTE mismatch to Si and warpage and silicon interposers in electrical performance and cost. Glass packages are being developed to manufacture both as wafers for improved performance over Si and as panels to improve bump pitch over organic packages. Glass, therefore, is not just a high performance and low volume technology, like silicon interposers, but a pervasive package technology with lower cost, higher performance and thinner than silicon and organic packages. Glass has compelling benefits in thickness and I/O pitch reduction and reliability for one of the highest volume applications, namely, the packaging of high I/O logic devices for smart mobile systems. This paper represents a paradigm shift in ultra-thin packages using large glass panels for future smart mobile and high performance devices, and the first demonstration of 100um thin glass packages with 50-80um c hip-level I/O pitch and 18 mm × 18mm body size surface mount assembly at 400um pitch.