• DocumentCode
    235044
  • Title

    Factors in the selection of temporary wafer handlers for 3D/2.5D integration

  • Author

    Bing Dang ; Webb, Benjamin ; Tsang, Cornelia ; Andry, Paul ; Knickerbocker, J.

  • Author_Institution
    IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    576
  • Lastpage
    581
  • Abstract
    This paper reviews the recent progress in temporary wafer handling technologies for 3D/2.5D wafer integration. Several critical factors in the selection of a temporary wafer handler technology for 3D/2.5D integration will be discussed and some recommendations are made.
  • Keywords
    integrated circuit bonding; three-dimensional integrated circuits; 3D-2.5D integration; temporary wafer handler selection; temporary wafer handling technology; Bonding; Glass; Silicon; Thermal resistance; Three-dimensional displays; Through-silicon vias;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897343
  • Filename
    6897343
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235044