DocumentCode
235094
Title
Design, modeling, and characterization of passive channels for data rates of 50 Gbps and beyond
Author
Beyene, Wendemagegnehu ; Yeon-Chang Hahm ; Secker, David ; Mullen, Don ; Shlepnev, Yuriy
Author_Institution
Rambus Inc., Sunnyvale, CA, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
730
Lastpage
735
Abstract
The design of interconnects for links operating at 50 Gbps and beyond is very challenging. The loss, dispersion, and discontinuities along the signaling path have to be minimized over a wide frequency range. Frequency dependent material properties and surface roughness has to be accurately considered. The impacts of short via stubs that are ignored at lower data rates can severely degrade the signals when operating at higher data rates. In order to provide ways to mitigate these effects and optimize the performance of the system, it is primarily essential to correctly model and characterize the passive channel. In this paper, the modeling and characterization techniques that guarantee successful designs of passive channels for data rates of 50 Gbps and beyond will be presented. Detailed studies and measurement results on the effects of short via stubs are also presented.
Keywords
passive networks; printed circuit design; printed circuit interconnections; surface roughness; bit rate 50 Gbit/s; data rates; discontinuities; dispersion; frequency dependent material properties; interconnect design; loss; passive channel characaterization; passive channel design; passive channel modelling; passive interconnect systems; printed circuit boards; short via stubs; signaling path; surface roughness; Conductors; Copper; Dielectrics; Insertion loss; Laminates; Scattering parameters; Transmission line measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897365
Filename
6897365
Link To Document