• DocumentCode
    235094
  • Title

    Design, modeling, and characterization of passive channels for data rates of 50 Gbps and beyond

  • Author

    Beyene, Wendemagegnehu ; Yeon-Chang Hahm ; Secker, David ; Mullen, Don ; Shlepnev, Yuriy

  • Author_Institution
    Rambus Inc., Sunnyvale, CA, USA
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    730
  • Lastpage
    735
  • Abstract
    The design of interconnects for links operating at 50 Gbps and beyond is very challenging. The loss, dispersion, and discontinuities along the signaling path have to be minimized over a wide frequency range. Frequency dependent material properties and surface roughness has to be accurately considered. The impacts of short via stubs that are ignored at lower data rates can severely degrade the signals when operating at higher data rates. In order to provide ways to mitigate these effects and optimize the performance of the system, it is primarily essential to correctly model and characterize the passive channel. In this paper, the modeling and characterization techniques that guarantee successful designs of passive channels for data rates of 50 Gbps and beyond will be presented. Detailed studies and measurement results on the effects of short via stubs are also presented.
  • Keywords
    passive networks; printed circuit design; printed circuit interconnections; surface roughness; bit rate 50 Gbit/s; data rates; discontinuities; dispersion; frequency dependent material properties; interconnect design; loss; passive channel characaterization; passive channel design; passive channel modelling; passive interconnect systems; printed circuit boards; short via stubs; signaling path; surface roughness; Conductors; Copper; Dielectrics; Insertion loss; Laminates; Scattering parameters; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897365
  • Filename
    6897365