DocumentCode
235279
Title
Integration of magnetic materials into package RF and power inductors on organic substrates for system in package (SiP) applications
Author
Hao Wu ; Gardner, Donald S. ; Cheng Lv ; Zhihua Zou ; Hongbin Yu
Author_Institution
Ira A. Fulton Schools of Eng., Arizona State Univ., Tempe, AZ, USA
fYear
2014
fDate
27-30 May 2014
Firstpage
1290
Lastpage
1295
Abstract
In this paper, soft ferromagnetic materials were deposited on organic packaging substrates to explore their potential applications in in-package inductors. Amorphous cobalt alloy, Co-Zr-Ta-B, was chosen due to its high saturation magnetization, low coercivity and small magnetostriction. As-deposited films were characterized by vibrating sample magnetometer (VSM) showing comparable magnetic properties in comparison to the films on quartz and silicon wafers. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on package substrates to explore their potential in-package RF and power inductor applications.
Keywords
amorphous magnetic materials; boron alloys; cobalt alloys; ferromagnetic materials; inductors; soft magnetic materials; system-in-package; tantalum alloys; zirconium alloys; Co-Zr-Ta-B; SIP; VSM; amorphous cobalt alloy; as-deposited films; films on quartz; in-package RF applications; in-package inductors; organic packaging substrates; package substrates; power inductor applications; silicon wafers; soft ferromagnetic materials; spiral inductors; stripline inductors; system in package; vibrating sample magnetometer; Glass; Inductors; Magnetic films; Polyimides; Stress; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location
Orlando, FL
Type
conf
DOI
10.1109/ECTC.2014.6897458
Filename
6897458
Link To Document