• DocumentCode
    2352845
  • Title

    Development of the base technology for surface multichipping modules on the multilayer polyimide boards having the increased mounting density of the add-on components and using modification 2 chip ic in order to organize production of the microelectronic

  • Author

    Guskov, G.Ya.

  • Author_Institution
    NPO ELAS
  • Volume
    4
  • fYear
    1996
  • fDate
    1996
  • Firstpage
    145
  • Lastpage
    147
  • Keywords
    Assembly; Ceramics; Frequency; Nonhomogeneous media; Packaging; Pins; Polyimides; Production; Soldering; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Satellite Communications, 1996. Proceedings of ICSC '96. The 2nd International Conference on
  • Type

    conf

  • DOI
    10.1109/ICSC.1996.864268
  • Filename
    864268
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2352845