E-TQHS: an enhanced performance tape carrier package

Author

Hsu, Pochang ; Raab, Kurt R.

Author_Institution

LSI Logic Corp., Fremont, CA, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

211

Lastpage

217

Abstract

In this paper, we discuss the design, development and analyze the electrical performance advantages of a new tape carrier package called E-TQHS (Enhanced Thin Quad Heat Spreader) for submicron ASICs. Compared to the fine pitch plastic QFPs and metal QFPs, the developed package with the feature of programmable single-point downbondings offers finer pad pitch solution, better performance and compatible surface mount interface to circuit boards. Design parametric analysis is also performed to understand its impact on electrical performance for future package improvement

Keywords

application specific integrated circuits; fine-pitch technology; integrated circuit packaging; surface mount technology; E-TQHS; Enhanced Thin Quad Heat Spreader; circuit boards; design parametric analysis; electrical performance; fine pad pitch; programmable single-point downbondings; submicron ASICs; surface mount interface; tape carrier package; Assembly; Bonding; Costs; Electronics packaging; Integrated circuit packaging; Large scale integration; Packaging machines; Performance analysis; Printed circuits; Surface-mount technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.514386

Filename

514386