DocumentCode
2354293
Title
Verification of etching rule in CAES
Author
Baba, Noriaki ; Makino, Koji ; Kakinaga, Takamitsu ; Tabata, Osamu ; Isono, Yoshitada ; Korvink, J.G.
Author_Institution
Ritsumeikan Univ., Kyoto, Japan
fYear
2003
fDate
19-22 Oct. 2003
Firstpage
277
Lastpage
280
Abstract
In this work, a relation between a removal probability in CAES and a calculated silicon etching rate was clarified. In order to verify the relation precisely, the number of removal probabilities utilized in CAES were increased from four to nine and simulation of etching rates were carried out with changing the removal probabilities. From these simulation results, the effects of removal probabilities on etching rates were clarified. Based on the obtained relation, experimentally obtained etching rates on various crystallographic planes were fitted by the CAES simulation. Although the experimental data was possible to fit mostly by CAES simulation, the accuracy of simulation was limited.
Keywords
crystal orientation; elemental semiconductors; etching; silicon; calculated silicon etching rate; cellular-automation etching simulator; crystallographic planes; etching rule verification; removal probability; Anisotropic magnetoresistance; Automata; Chemical processes; Chemical technology; Crystallography; Educational institutions; Probability; Shape; Silicon; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Micromechatronics and Human Science, 2003. MHS 2003. Proceedings of 2003 International Symposium on
Print_ISBN
0-7803-8165-3
Type
conf
DOI
10.1109/MHS.2003.1249948
Filename
1249948
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