DocumentCode
2355153
Title
Compensation of ESD and input capacitance effect by using package bondwire inductance for over Gbps differential SerDes devices
Author
Ahn, Seungyoung ; Park, Jongbae ; Chung, Daehyun ; Kim, Joungho
Author_Institution
Terahertz Interconnection & Package Lab., Korea Adv. Inst. of Sci. & Technol., South Korea
fYear
2003
fDate
27-29 Oct. 2003
Firstpage
159
Lastpage
162
Abstract
We firstly introduce the compensation of ICs input capacitance effect by using the package bondwire inductance. With the analysis of this effect, we suggested the methodology of finding optimized inductance and demonstrated the improvement in time-domain performance by simulation and measurement.
Keywords
ball grid arrays; compensation; electrostatic discharge; inductance; integrated circuit packaging; lead bonding; transceivers; BGA package; IC chip; differential SerDes devices; electrostatic discharge compensation; equivalent circuit model; eye-diagram; input capacitance effect; insertion loss; optimized inductance; package bondwire inductance; protection circuit; return loss; time-domain performance; Bonding; Capacitance; Circuits; Electrostatic discharge; Equations; Frequency; Impedance; Inductance; Insertion loss; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2003
Conference_Location
Princeton, NJ, USA
Print_ISBN
0-7803-8128-9
Type
conf
DOI
10.1109/EPEP.2003.1250022
Filename
1250022
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