Model for determining thermal profiles of bond wires using `PSICE´ analysis

A method has been developed that utilizes PSPICE to determine the thermal response of a bond wire using an equivalent electrical circuit based upon the physical and thermal properties of a specific bond wire. All temperature-sensitive properties are modeled to reflect these sensitivities. Parameters to be modeled are electrical resistivity, thermal conductivity, specific heat, the convection heat transfer coefficient, and the heat of fusion. Also, a variety of models are examined to determine an optimum number of model sections for required response accuracy. The three-section model is adequate for determining bond wire fusing conditions