• DocumentCode
    2356266
  • Title

    P2P-10 Electrostatic-Mechanical Direct Coupling and FEM-BEM Coupling for CMUT Electroacoustic Parameters Identification

  • Author

    Ekeom, D.

  • Author_Institution
    Inst. d ´´Electronique de Microelectronique et de Nanotechnologie, Departement ISEN, Lille
  • fYear
    2006
  • fDate
    2-6 Oct. 2006
  • Firstpage
    1971
  • Lastpage
    1974
  • Abstract
    Capacitive micromachined ultrasonic transducer (CMUT) arrays are seen as a promising way to improve ultrasound-imaging definition and they may supplant piezocomposite arrays for such applications. However, as a new technology it needs to be evaluated and modelling can help to design devices using cMUT technology. Implicit finite element codes are commonly used to model cMUT devices, but to take into account the fluid surrounding the device $radiation, scattering and the inter-mutual acoustic influence of the CMUT arrays cells - the boundary element method (BEM) coupled with the finite element method (FEM) can be advantageously used. Moreover the standard electromechanical coupling is either weak or lumped and cannot be used to model CMUT accurately. A FEM-BEM coupling together with an electro-mechanical direct coupling as add-on modules for ANSYSreg were developed. This paper will show how to identify exact nonlinear equivalent circuit lumped parameters from a FEM and FEM-BEM simulation. The electrical and motional branch of the circuit is identified by resonance and antiresonance modal analysis. The radiating impedance is computed using a FEM-BEM coupling in frequency domain. Finally the transducer insertion loss is evaluate
  • Keywords
    acoustoelectric effects; acoustoelectric transducers; boundary-elements methods; electromechanical effects; finite element analysis; micromechanical devices; ultrasonic transducer arrays; ANSYS; CMUT arrays; CMUT electroacoustic parameters; FEM-BEM coupling; antiresonance modal analysis; boundary element method; capacitive micromachined ultrasonic transducer arrays; electromechanical coupling; electrostatic-mechanical direct coupling; equivalent circuit; finite element codes; finite element method; radiating impedance; transducer insertion loss; ultrasound-imaging definition; Acoustic arrays; Acoustic devices; Acoustic scattering; Boundary element methods; Coupling circuits; Finite element methods; Parameter estimation; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2006. IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1051-0117
  • Print_ISBN
    1-4244-0201-8
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2006.498
  • Filename
    4152354