• DocumentCode
    235643
  • Title

    Soft CMP pads for low defectivity in CMP processes

  • Author

    Fengji Yeh ; Yeh, Anson ; DeGroot, Marty W. ; Qian, Bainian ; Reddy, Arun ; Buley, Todd

  • Author_Institution
    Rohm & Haas Electron. Mater. Asia Pacific Co. Ltd., Jhunan, Taiwan
  • fYear
    2014
  • fDate
    19-21 Nov. 2014
  • Firstpage
    174
  • Lastpage
    177
  • Abstract
    New approaches to soft polyurethane materials have been developed with the characteristics of high texturability and tunability in physical properties. The approach has resulted in low defectivity and high performance stability in a range of sensitive CMP applications, including copper barrier applications.
  • Keywords
    chemical mechanical polishing; CMP processes; copper barrier applications; low defectivity; soft CMP pads; soft polyurethane materials; Companies; Copper; Planarization; Slurries; Surface texture;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2014 International Conference on
  • Conference_Location
    Kobe
  • Print_ISBN
    978-1-4799-5556-5
  • Type

    conf

  • DOI
    10.1109/ICPT.2014.7017273
  • Filename
    7017273
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235643