The effect of fluid pH for 2-body lapping process

Glass ceramics is one of the key materials for the optoelectronic devices. Lapping is a critical technology which controls the thickness and flatness of the substrate. The modified lapping process using the fixed diamond abrasive pad with DIW (De-ionized water) was evaluated and suggested in the previous our study to replace the conventional process which has problems in terms of environment and CoO (Cost of Ownership). In this study, the effect of DIW pH on the glass lapping process was investigated fundamentally. It was found that the removal behavior of for SiO₂ materials as the function of fluid pH was different compared to the reported literatures.