• DocumentCode
    235721
  • Title

    Degradation behavior of ceria-based abrasives slurry during glass polishing

  • Author

    Kawahara, Kenji ; Suzuki, Takumi ; Suda, Seiichi

  • Author_Institution
    Japan Fine Ceramics Center, Nagoya, Japan
  • fYear
    2014
  • fDate
    19-21 Nov. 2014
  • Firstpage
    340
  • Lastpage
    343
  • Abstract
    Ceria-based abrasives are indispensable for precise polishing of glass substrates. It is of great importance to understand degradation behavior of abrasive slurry for reducing the polishing costs. In this study, we quantitatively investigated the degradation behavior of ceria-based abrasive slurry in glass polishing. Degradation profiles were found to be classified into two regions; the region where degradation was not severe (Region I) and the region where the removal rate rapidly decreased with polishing time (Region Π). The results suggested that the removed glass fragments would cover the active sites of abrasives resulting in the transition from Region I to Region II.
  • Keywords
    abrasion; abrasives; glass; polishing; slurries; abrasive slurry; ceria based abrasives slurry; degradation behavior; glass polishing; polishing cost reduction; Abrasives; Degradation; Glass; Shape; Slurries; Solvents; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2014 International Conference on
  • Conference_Location
    Kobe
  • Print_ISBN
    978-1-4799-5556-5
  • Type

    conf

  • DOI
    10.1109/ICPT.2014.7017315
  • Filename
    7017315