• DocumentCode
    2357399
  • Title

    Partial discharge testing and AC characterization of HV connectors and terminations

  • Author

    Rush, Jim L.

  • Author_Institution
    Teledyne Reynolds Inc., Los Angeles, CA, USA
  • fYear
    2010
  • fDate
    23-27 May 2010
  • Firstpage
    521
  • Lastpage
    525
  • Abstract
    Characterization of partial discharge behavior is an effective tool in selecting dielectric materials, establishing voltage ratings, and indentifying exposure dependent failure modes of high voltage connectors and terminations. By understanding a component´s response to partial discharge activity, material selection, geometries, and interfaces can be optimized to increase endurance and reliability. Partial discharge behavior is associated with dielectric aging and exposure dependent reduction in dielectric strength. Long term electrical aging influences several stress types, which have reversible and/or irreversible effects on the material and result in electrical, thermal, and partial discharge breakdown mechanisms. When combined with partial discharge measurements, a life-stress relationship is established using accelerated life testing, with thermal, voltage, and time acceleration factors. Since long-term electrical ageing exists with the presence of partial discharge, inception and extinction voltages are used to establish criteria for accelerated life test voltages. A methodology is presented for performance of partial discharge detection, selection of life test parameters, and analyses of post test results.
  • Keywords
    ageing; electric connectors; failure analysis; high-voltage techniques; optimisation; partial discharge measurement; HV connectors; dielectric materials; electrical aging; failure modes; optimization; partial discharge measurements; terminations; Communication cables; Connectors; Corona; Dielectrics; Materials; Partial discharges; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Modulator and High Voltage Conference (IPMHVC), 2010 IEEE International
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-7131-7
  • Type

    conf

  • DOI
    10.1109/IPMHVC.2010.5958409
  • Filename
    5958409