DocumentCode
2357505
Title
Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities
Author
Rencz, M. ; Szekely, V. ; Morelli, A. ; Villa, C.
Author_Institution
MicReD Ltd., Budapest, Hungary
fYear
2002
fDate
12-14 March 2002
Firstpage
15
Lastpage
20
Abstract
The evaluation of the thermal transient measurements may result in the time constant density function and the structure function of the measured structure. In this paper we show how these results can be used to detect die attach or soldering problems of packages. Another application of the method in detecting partial thermal resistances in the heat flow path is also presented and evaluated.
Keywords
microassembling; packaging; soldering; thermal resistance; transients; die attach discontinuities; heat flow path; package; partial thermal resistances; soldering problems; structure function; time constant density function; transient measurements; Density measurement; Electrical resistance measurement; Microassembly; Packaging; Resistance heating; Semiconductor device measurement; Steady-state; Testing; Thermal resistance; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location
San Jose, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-7327-8
Type
conf
DOI
10.1109/STHERM.2002.991340
Filename
991340
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