• DocumentCode
    2357711
  • Title

    Improving simulation accuracy for SMT packages by incorporating trace level details in PCB thermal modeling

  • Author

    Swaminathan, V. ; Venkatakrishnan, G. ; Tan, Whei Sheng ; Ooi, Wei Meng

  • Author_Institution
    TCI, Delphi Automotive Syst. Pvt Ltd., Bangalore, India
  • fYear
    2010
  • fDate
    8-10 Dec. 2010
  • Firstpage
    185
  • Lastpage
    189
  • Abstract
    The need for accurate trace level modeling is emphasized, by comparing simulated junction temperatures of a SMT package on a PCB under different combinations of trace layout. The results show that detail modeling of traces around the device has a significant impact on the predicted temperatures and over-simplified PCB models can cause unacceptable errors.
  • Keywords
    surface mount technology; thermal management (packaging); PCB thermal modeling; SMT package; junction temperature; simulation accuracy; trace level detail;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2010 12th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8560-4
  • Electronic_ISBN
    978-1-4244-8561-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2010.5702630
  • Filename
    5702630
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2357711