DocumentCode
2357749
Title
P3L-1 Elastic Moduli, and their Temperature Coefficients, of Piezoelectric and Nonpiezoelectric Polycrystalline Aggregates
Author
Ballato, Arthur
Author_Institution
AMSRD-CER-CS, US Army Commun.-Electron. Res., Dev. & Eng. Center, Fort Monmouth, NJ
fYear
2006
fDate
2-6 Oct. 2006
Firstpage
2250
Lastpage
2253
Abstract
Classical procedures for computing average isotropic elastic moduli of polycrystalline aggregates are associated with the names of Voigt, Reuss, and Hill. The Voigt-Reuss-Hill (VRH) procedures apply to averaging moduli subject solely to mechanical boundary conditions. Piezoelectrics in general, are required to be characterized by both mechanical and electrical boundary conditions. This paper describes proper averaging for piezoelectrics, along with an advanced averaging method. Numerical values are provided for examples using materials with strong piezocoupling values. The examples demonstrate that the piezoelectric effect must be taken into account in the averaging process. Associated temperature coefficients of the elastic moduli are also supplied for some technologically important piezoelectric and nonpiezoelectric substances
Keywords
aggregates (materials); elastic moduli; piezoelectric materials; Voigt-Reuss-Hill procedure; elastic moduli; electrical boundary condition; mechanical boundary condition; nonpiezoelectric polycrystalline aggregates; piezocoupling; piezoelectric polycrystalline aggregates; temperature coefficient; Aggregates; Anisotropic magnetoresistance; Arithmetic; Boundary conditions; Capacitive sensors; Crystallization; Equations; Piezoelectricity; Space technology; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2006. IEEE
Conference_Location
Vancouver, BC
ISSN
1051-0117
Print_ISBN
1-4244-0201-8
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2006.568
Filename
4152424
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