DocumentCode
2358026
Title
Characterization of alumina-based LTCC composite materials: Thermal and electrical properties
Author
Ibrahim, Azmi ; Alias, Rosidah ; Ambak, Zulkifli ; Yusoff, Mohd Zulfadli Mohamed ; Shapee, Sabrina Mohd ; Saad, Muhammad Redzuan ; Yusoff, Ashaari ; Mahmood, Che Seman ; Al Rashid Megat Ahmad, Megat Harun
fYear
2010
fDate
8-10 Dec. 2010
Firstpage
269
Lastpage
272
Abstract
The study on Low temperature co-fired ceramic (LTCC) has been widely investigated due to its potential as an advanced approach for packaging of electronics devices. This paper evaluates and discusses about the firing temperatures effect on the densification, thermal and electrical properties of the prepared LTCC material. The LTCC tape, which consists mostly of Al2O3 was fabricated using tape casting technique. Five layers of tapes were then stacked and air-fired at different temperatures of 840, 880, 920 and 960°C. All samples were characterized for thermal and electrical properties. The crystallinity and microstructure of all samples were studied using XRD and SEM respectively. Current investigations show that the changing of density or volume fraction of pores is the main reason for the dielectric properties shift. Meanwhile, the changing in lattice parameters is observed as the main reason in thermal diffusivity shift. The sample fired at 880°C has the best thermal and electrical properties with thermal diffusivity of about 0.62 mm2/s, dielectric constant (εr) of about 5.65 and dielectric loss, tan (δ) of about 0.003.
Keywords
alumina; ceramic packaging; crystal microstructure; densification; dielectric properties; firing (materials); tape casting; thermal management (packaging); Al2O3; LTCC material; SEM; XRD; alumina-based LTCC composite material; crystallinity; densification; density; dielectric properties; electrical properties; electronic device packaging; firing temperature effect; lattice parameter; low temperature co-fired ceramic; microstructure; tape casting technique; temperature 840 C; temperature 880 C; temperature 920 C; temperature 960 C; thermal diffusivity; thermal properties; volume fraction;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2010 12th
Conference_Location
Singapore
Print_ISBN
978-1-4244-8560-4
Electronic_ISBN
978-1-4244-8561-1
Type
conf
DOI
10.1109/EPTC.2010.5702646
Filename
5702646
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