• DocumentCode
    2358061
  • Title

    P3O-5 High Frequency and High Temperature SAW Devices Based on Nanocrystalline Diamond Film on Langasite Substrate

  • Author

    El Hakiki, M. ; Elmazria, O. ; Benedit, F. ; Nicolay, P. ; Azouani, R. ; Moneger, D.

  • Author_Institution
    Nancy Univ., CNRS, Nancy
  • fYear
    2006
  • fDate
    2-6 Oct. 2006
  • Firstpage
    2310
  • Lastpage
    2313
  • Abstract
    The new layered structure diamond/langasite is studied for high temperature, high frequency and relatively high electromechanical coupling (K2) SAW devices. Theoretical study was performed in order to calculate the evolution, as a function of diamond film thickness, of phase velocity and K2 of the Rayleigh mode and its higher modes. The calculation results show that phase velocities up to 12000 m/s and up to 9500 m/s are obtained for the mode 2 and mode 1, respectively, while the mode 0 exhibits high K2 values up to 2.9 %. In order to realize the considered layered structure, first experiments were performed to investigate the nanocrystalline diamond (NCD) films deposition on the non conventional substrate, Langasite. Characterization results show that NCD films with good properties (low grain size, low surface roughness, satisfactory purity) can be grown on Langasite. However, in the considered conditions only an optimal NCD thickness estimated around 1 mum permits to avoid film delamination and cracking when returning to room temperature
  • Keywords
    Rayleigh waves; diamond; nanostructured materials; piezoelectric devices; surface acoustic wave devices; C; LaGaSi; Rayleigh mode; diamond film thickness; electromechanical coupling SAW devices; film cracking; film delamination; grain size; high temperature SAW devices; langasite substrate; nanocrystalline diamond film deposition; phase velocity; satisfactory purity; surface roughness; Frequency; Grain size; High K dielectric materials; High-K gate dielectrics; Nanoscale devices; Rough surfaces; Substrates; Surface acoustic wave devices; Surface roughness; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2006. IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1051-0117
  • Print_ISBN
    1-4244-0201-8
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2006.584
  • Filename
    4152440