A novel low-cost package RF function verification by oscillator specification variation

Author

Chen, Yi-Han ; Yeh, Wei-Ting ; Wu, Sung-Mao ; Tu, Chen-Chia ; Hwang, Jun-Jie

Author_Institution

Dept. of Electr. Eng., Nat. Univ. of Kaohsiung, Kaohsiung, Taiwan

fYear

2010

fDate

8-10 Dec. 2010

Firstpage

408

Lastpage

411

Abstract

This paper is focus on low cost testing method for process variation filters which is made by integrated passive device (IPD) or discrete circuit by one easy circuit, oscillator (OSC). The research is base on studying a new method to test by using a simple circuit. The 2.4GHz band-pass filter (BPF) as the device under test (DUT), using the OSC as a test circuit. For using OSC as a test circuit to the basic structure, we take band pass filter into a part of LC tank in OSC. When filters have process variation, the frequency of the OSC will change. Then determine the quality of the band-pass filter. At last, this test circuit will make a test board to measure the data practically to prove this new method for low cost testing.

Keywords

band-pass filters; oscillators; semiconductor device packaging; semiconductor device testing; BPF; DUT; IPD; OSC; band-pass filter; device under test; discrete circuit; frequency 2.4 GHz; integrated passive device; low cost testing method; low-cost package RF function verification; oscillator specification variation; process variation filter; Oscillators; negative resistance; resonator filters; test equipment;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2010 12th

Conference_Location

Singapore

Print_ISBN

978-1-4244-8560-4

Electronic_ISBN

978-1-4244-8561-1

Type

conf

DOI

10.1109/EPTC.2010.5702673

Filename

5702673