Embedding of 15um thin chip and passives in thin flexible substrate

This study demonstrates the embedding of ultra-thin 15um active chips and passives in flexible printed circuit substrates. We describe the process of fabricating the embedded-actives-and-passives modules, starting with the fabrication of the chips and passives, followed by chip bonding, lamination, via exposure and via plating to build up the module. Mechanical integrity tests are then performed using moisture sensitivity, shear and bend tests. Results show good mechanical robustness of the modules, indicating a promising technology for implementation into manufacturing.