• DocumentCode
    235932
  • Title

    Fusion prognostics-based qualification of microelectronic devices

  • Author

    Pecht, Michael ; George, Elviz ; Vasan, Arvind ; Chauhan, Prakash

  • Author_Institution
    Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    383
  • Lastpage
    389
  • Abstract
    The rapid evolution of electronic products has resulted in numerous choices for customers. This has made for intense competition between manufacturers to reduce costs and minimize the time to market for their products. One bottle-neck in getting products to market is the qualification process, which has traditionally been time-consuming and often inadequate to prevent failures in field. In particular, in the past decade, there have been significant numbers of microelectronic devices that have passed qualification tests but failed in the field. The resulting costs of these failures have been in the billions of dollars. Thus, there is a need to develop approaches to qualification methodologies that quicken the development time but also prevent product failures in the field. This paper discusses the current state of qualification practices in the electronics industry. Then, an alternative approach, called fusion prognostics, for qualification is presented that can make the process more efficient and cost-effective. This approach involves an in-situ qualification process that incorporates a fusion of machine learning techniques and physics-of-failure based prognostics. The machine learning techniques are used to monitor the degradation behavior during testing. On the other hand, the physics-of-failure techniques identify critical failure mechanisms and the acceleration factors.
  • Keywords
    electronic engineering computing; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; learning (artificial intelligence); production engineering computing; quality management; electronics industry; fusion prognostic; in-situ qualification process; machine learning technique; microelectronic device qualification; physics-of-failure based prognostics; product failure; qualification practice; qualification test; Decision support systems; Failure analysis; Integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898209
  • Filename
    6898209