Evaluation of support wafer system for thin wafer handling

The optimization of the temporary wafer bonding process for thin wafers handling is reported. Two temporary bonding materials are evaluated with two low temperature cure (200degC) dielectrics. TGA results show that the dielectric materials are more stable at high temperature (260degC) with not more than 1% weight loss while the temporary bonding adhesives gave a higher weigh loss of 5.5%. It is found that optimal dehydration bake on both device and carrier wafer can create a void-free bonding. The dielectric and bonding material compatibility is also important to prevent temporary bonding from voiding.