Flexible Circuits with embedded resistors subjected to extreme thermal loading conditions using the Shadow Moiré and FEM measurements techniques

Author

Arruda, Luciano ; Marinho, Luanda ; Silva, Edson ; Machado, Willy

Author_Institution

Inst. Nokia de Tecnol. - INdT, Manaus, Brazil

fYear

2010

fDate

26-28 April 2010

Firstpage

1

Lastpage

6

Abstract

The objective of this work is to study flexible Printed Circuits Boards (fPCBs) using a ThermoMoireÂ¿ chamber for measuring fPCBs surface warpage as a function of temperature in orders to evaluate its displacements. A 3-D computational modelling in a multilayer configuration will be used to compare with a typical FEM simulation. Additionally, it will be demonstrated a defect inspection using an Acoustic Scanning Microscope (SAM) to find delamination failure after a Thermal Shock Test (TST).

Keywords

finite element analysis; printed circuits; resistors; thermal shock; 3D computational modelling; FEM measurements techniques; acoustic scanning microscope; embedded resistors; fPCB; flexible printed circuits boards; multilayer configuration; shadow Moire techniques; thermal shock test; Acoustic measurements; Computational modeling; Displacement measurement; Flexible printed circuits; Measurement techniques; Nonhomogeneous media; Resistors; Temperature; Thermal loading; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on

Conference_Location

Bordeaux

Print_ISBN

978-1-4244-7026-6

Type

conf

DOI

10.1109/ESIME.2010.5464575

Filename

5464575