DocumentCode
2361684
Title
Simulation of test wafer consumption in a semiconductor facility
Author
Foster, Bryce ; Meyersdorf, Doron ; Padillo, José M. ; Brenner, Rafi
Author_Institution
TEFEN Ltd., Foster City, CA, USA
fYear
1998
fDate
23-25 Sep 1998
Firstpage
298
Lastpage
302
Abstract
A discrete event simulation methodology was developed to assist in managing test wafer usage in semiconductor fabs. The purpose of modeling test wafer usage is to predict the number of new test wafers required, test wafer WIP levels, and how to downgrade test wafers to reduce costs of purchasing new test wafers. The test wafer simulation methodology is a detailed yet accurate way to predict test wafer consumption. The methodology has been implemented in a 200 mm development facility, resulting in considerable cost savings by reducing the overall WIP levels of test wafers
Keywords
discrete event simulation; integrated circuit testing; production testing; semiconductor process modelling; WIP levels; cost savings; development facility; discrete event simulation methodology; semiconductor fabs; semiconductor facility; test wafer WIP levels; test wafer consumption; test wafer consumption prediction; test wafer consumption simulation; test wafer costs; test wafer downgrading; test wafer purchasing; test wafer requirements; test wafer simulation methodology; test wafer usage; test wafer usage modelling; Analytical models; Benchmark testing; Costs; Discrete event simulation; Linear programming; Predictive models; Production; Semiconductor device modeling; Semiconductor device testing; Statistical analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-4380-8
Type
conf
DOI
10.1109/ASMC.1998.731576
Filename
731576
Link To Document