DocumentCode
2364549
Title
Reworkable encapsulation
Author
Buchwalter, Stephen L. ; Gelorme, Jeffrey D.
Author_Institution
Res. Div., IBM Corp., Yorktown Heights, NY, USA
fYear
1995
fDate
1-3 May 1995
Firstpage
81
Lastpage
82
Abstract
Epoxy thermosetting plastics continue to be a mainstay for electronic packaging, because of their ability to provide high reliability at low cost, One negative associated with the use of epoxy thermosets is their intractability after curing, which prevents their removal for rework or recycling of microelectronic assemblies. As a solution to this problem, we report on the development of a new functional equivalent, thermosetting epoxy which is easily removed
Keywords
encapsulation; packaging; polymers; electronic packaging; epoxy thermosetting plastics; high reliability; microelectronic assemblies; reworkable encapsulation; Assembly; Curing; Encapsulation; Flip chip; Material properties; Materials testing; Microelectronics; Semiconductor device packaging; Semiconductor devices; Solvents;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on
Conference_Location
Orlando, FL
Print_ISBN
0-7803-2137-5
Type
conf
DOI
10.1109/ISEE.1995.514954
Filename
514954
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