DocumentCode
2364626
Title
Evaluative analysis of no-clean soldering technologies for printed wiring boards and assemblies
Author
Ciocci, Richard
Author_Institution
CALCE Center for Electron. Packaging, Maryland Univ., College Park, MD, USA
fYear
1995
fDate
1-3 May 1995
Firstpage
106
Lastpage
109
Abstract
While no-clean technologies do reduce adverse environmental impact, their effect on product reliability must be considered. Manufacturers who choose to convert to no-clean materials and processes need assurance that product performance is not adversely affected. Environmental effect, manufacturing capability, and product reliability are all valid criteria for a materials and process selection method
Keywords
circuit reliability; environmental factors; printed circuit manufacture; soldering; adverse environmental impact; manufacturing capability; materials selection method; no-clean soldering technologies; printed wiring boards; process selection method; product reliability; Assembly; Cleaning; Computer aided manufacturing; Costs; Electronics packaging; Manufacturing processes; Materials reliability; Soldering; Switches; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 1995. ISEE., Proceedings of the 1995 IEEE International Symposium on
Conference_Location
Orlando, FL
Print_ISBN
0-7803-2137-5
Type
conf
DOI
10.1109/ISEE.1995.514959
Filename
514959
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