Packaging Materials User in a New Era - Material & Packaging Solution Correspondent with Semiconductor

With a higher integration of IC, advanced IC packages are evolving to various features. They are being required to be smaller and. thinner nevertheless the chips they contain being more fragile. For sustaining this evolution. Sumitomo Bakelite has provided a lot of packaging materials. Since the advanced 10 packages are assembled by using various kinds of materials, it becomes difficult to cope with the requirement by studying only a certain material. Furthermore, IC substrate is also required, to be thinner and multi-layered, securing a reliability of the inter layer connection is the first priority matter; Then we rather have to examine the most suitable combination of the materials. This keynote address describes the trend of advanced packages and our challenges to propose the total solution with the best combination of the packaging materials and IC substrate. An optical waveguide substrate as a foreseeing optelectronics generation is also surveyed