Table of contents - Technical papers

fYear

2014

fDate

4-8 Aug. 2014

Firstpage

1

Lastpage

25

Abstract

The following topics are dealt with: wireless EMC measurements; spectrum management; nanotechnology; 3D integration; advanced noise-jitter modeling; numerical modeling; EMI systems; radiofrequency interference; high speed interconnect design; cables; connectors; statistical analysis; power integrity design; PCB; ESD; lightning; antennas; information security; package material and channel emulation.

Keywords

antennas; electric connectors; electromagnetic compatibility; electrostatic discharge; integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; nanotechnology; numerical analysis; printed circuit design; radio spectrum management; radiofrequency interconnections; radiofrequency interference; radiotelemetry; statistical analysis; telecommunication cables; telecommunication network management; telecommunication security; three-dimensional integrated circuits; wireless channels; 3D integration; EMI system; ESD; PCB; advanced noise-jitter modeling; antenna; cable; channel emulation; connector; high speed interconnect design; information security; lightning; nanotechnology; numerical modeling; package material; power integrity design; radiofrequency interference; spectrum management; statistical analysis; wireless EMC measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on

Conference_Location

Raleigh, NC

Print_ISBN

978-1-4799-5544-2

Type

conf

DOI

10.1109/ISEMC.2014.6898929

Filename

6898929