DocumentCode
2368353
Title
Effects of technology and dimensional scaling on input loss prediction of RF MOSFETs
Author
Das, Tejasvi ; Washburn, Clyde ; Mukund, P.R. ; Howard, Steve ; Paradis, Ken ; Jang, Jung-Geau ; Kolnik, Jan ; Burleson, Jeff
Author_Institution
Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
fYear
2005
fDate
3-7 Jan. 2005
Firstpage
295
Lastpage
300
Abstract
In this paper, we present the impact of both process and dimensional scaling on input loss (S11) prediction of MOSFET´s at GHz frequencies. We study the distributed gate effect, the non-quasi static effect, and report a drop in the resistive component of S11 for larger fingered devices at high frequencies (> 5 GHz). We identify the boundary at which such effects start dominating. A modification to the existing lumped model is presented that tracks this effect with high accuracy. The impact of oxide thickness on S11 in the same process and across two different processes is also presented. The study was validated with the fabrication of an extensive set of RF dimensioned transistors in LSI Logic´s 0.18 μm and 0.11 μm processes, across five different wafers.
Keywords
CMOS integrated circuits; MOSFET; S-parameters; radiofrequency integrated circuits; semiconductor device models; 0.11 micron; 0.18 micron; LSI Logic; RF MOSFET; RF dimensioned transistors; dimensional scaling; distributed gate effect; input loss prediction; lumped model; nonquasi static effect; oxide thickness; process scaling; resistive component; technology scaling; CMOS process; CMOS technology; Circuit noise; Electrical resistance measurement; Frequency estimation; Large scale integration; MOS devices; MOSFETs; Radio frequency; Semiconductor device noise;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Design, 2005. 18th International Conference on
ISSN
1063-9667
Print_ISBN
0-7695-2264-5
Type
conf
DOI
10.1109/ICVD.2005.86
Filename
1383291
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