• DocumentCode
    2368511
  • Title

    An efficient methodology for noise characterization

  • Author

    Varshney, Gurav Kumar ; Chandrasekar, Sreeram

  • Author_Institution
    Texas Instrum., Bangalore, India
  • fYear
    2005
  • fDate
    3-7 Jan. 2005
  • Firstpage
    330
  • Lastpage
    335
  • Abstract
    In the recent years, the impact of nanometer process technologies has increased capacitive coupling and causing signal noise. Static noise analysis has become the most adopted method for performing signal integrity (SI) checks. This method requires noise characterization data in ASIC cell libraries to avoid spice simulations during chip level analysis. Characterization of noise parameters (output current voltage characteristics, noise rejection and noise propagation) accounts for around 60% of the total ASIC library characterization cycle time. This paper describes a novel and optimal method of measuring different noise parameters using data trend analysis, curve-fitting and interpolation techniques. It aims at reducing the characterization runtime without any loss in data accuracy and also without requiring extra inputs from the users. A runtime improvement of 4× has been demonstrated using this methodology.
  • Keywords
    application specific integrated circuits; circuit simulation; curve fitting; integrated circuit design; integrated circuit noise; interpolation; noise measurement; ASIC cell libraries; capacitive coupling; chip level analysis; nanometer process technology; noise characterization; noise propagation; noise rejection; output current voltage characteristics; signal integrity check; signal noise; spice simulations; static noise analysis; Analytical models; Application specific integrated circuits; Current-voltage characteristics; Libraries; Noise level; Noise measurement; Performance analysis; Runtime; Signal analysis; Signal processing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Design, 2005. 18th International Conference on
  • ISSN
    1063-9667
  • Print_ISBN
    0-7695-2264-5
  • Type

    conf

  • DOI
    10.1109/ICVD.2005.50
  • Filename
    1383297