DocumentCode
2368513
Title
Interaction analysis and insulation techniques for short-circuit integrated protection structure
Author
Caramel, C. ; Austin, P. ; Sanchez, J.L. ; Imbernon, E. ; Rousset, B.
Author_Institution
LAAS-CNRS, Toulouse
fYear
2006
fDate
4-8 June 2006
Firstpage
1
Lastpage
4
Abstract
One of the steps of the power components reliability improvement is to integrate protection structures (Robb, 1994 and Yeki, 1994). An integrated structure which protect IGBT against short-circuit conditions has already been studied. This structure has been studied and improved for its integration in a classical IGBT technological process (Caramel, 2006). Generally, the integration of protection structures and power devices on the same substrate leads to insulation problems. In order to overcome these problems for our application, we propose in these paper three insulation techniques compatible with a classical IGBT technological process. [2D] numerical simulations have been thus performed in order to highlight the necessity of insulation and for compare the insulation techniques efficiency
Keywords
insulated gate bipolar transistors; insulation; power bipolar transistors; semiconductor device models; semiconductor device reliability; short-circuit currents; 2D numerical simulations; IGBT technological process; insulated gate bipolar transistor; insulation techniques; integrated protection structure; power components reliability; short-circuit conditions; Anodes; Cathodes; Delay; Diodes; Insulated gate bipolar transistors; Insulation; Low voltage; Protection; Threshold voltage; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and IC's, 2006. ISPSD 2006. IEEE International Symposium on
Conference_Location
Naples
Print_ISBN
0-7803-9714-2
Type
conf
DOI
10.1109/ISPSD.2006.1666117
Filename
1666117
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