• DocumentCode
    2368513
  • Title

    Interaction analysis and insulation techniques for short-circuit integrated protection structure

  • Author

    Caramel, C. ; Austin, P. ; Sanchez, J.L. ; Imbernon, E. ; Rousset, B.

  • Author_Institution
    LAAS-CNRS, Toulouse
  • fYear
    2006
  • fDate
    4-8 June 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    One of the steps of the power components reliability improvement is to integrate protection structures (Robb, 1994 and Yeki, 1994). An integrated structure which protect IGBT against short-circuit conditions has already been studied. This structure has been studied and improved for its integration in a classical IGBT technological process (Caramel, 2006). Generally, the integration of protection structures and power devices on the same substrate leads to insulation problems. In order to overcome these problems for our application, we propose in these paper three insulation techniques compatible with a classical IGBT technological process. [2D] numerical simulations have been thus performed in order to highlight the necessity of insulation and for compare the insulation techniques efficiency
  • Keywords
    insulated gate bipolar transistors; insulation; power bipolar transistors; semiconductor device models; semiconductor device reliability; short-circuit currents; 2D numerical simulations; IGBT technological process; insulated gate bipolar transistor; insulation techniques; integrated protection structure; power components reliability; short-circuit conditions; Anodes; Cathodes; Delay; Diodes; Insulated gate bipolar transistors; Insulation; Low voltage; Protection; Threshold voltage; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 2006. ISPSD 2006. IEEE International Symposium on
  • Conference_Location
    Naples
  • Print_ISBN
    0-7803-9714-2
  • Type

    conf

  • DOI
    10.1109/ISPSD.2006.1666117
  • Filename
    1666117