• DocumentCode
    2369014
  • Title

    Preparation and characterization of magnetic carboxymethyl chitosan/Fe3O4 composite nanoparticles

  • Author

    Li-Min Zhou ; Yi-ping Wang ; Qun-Wu Huang ; Zhi-Rong Liue

  • Author_Institution
    Key Lab. of Nucl. Resources & Environ. of Minist. of Educ., East China Inst. of Technol., Fuzhou
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    882
  • Lastpage
    885
  • Abstract
    Monodisperse carboxymethyl chitosan-bound Fe3O4 magnetic nanoparticles can be potentially used as drug delivery carrier and a novel magnetic nano-adsorbent for the removal of pollutants from aqueous solutions. In this paper, the magnetic chitosan nanoparticles of about 20 nm were prepared by the carboxymethylation of chitosan and the followed binding on the surface of Fe3O4 nanoparticles which were prepared using a coprecipitation method The images of transmission electron microscope showed that the magnetic iron oxide particles were encapsulated by the spherical chitosan nanoparticles. XRD indicated that the magnetic component of the composite nanoparticles were validated as Fe3O4. FTIR spectra confirmed the carboxymethyl reaction of chitosan and the binding of carboxylmethyl chitosan on Fe3O4. The saturated magnetization of composite nanoparticles could reach 25.7 emu/g. Meanwhile, the nanoparticles showed the characteristics of superparamagnetism.
  • Keywords
    Fourier transform spectroscopy; X-ray diffraction; composite materials; drug delivery systems; infrared spectroscopy; iron compounds; nanoparticles; organic compounds; precipitation; superparamagnetism; transmission electron microscopes; FTIR spectra; Fe3O4; XRD; composite nanoparticles; coprecipitation; drug delivery carrier; magnetic carboxymethyl chitosan; magnetic nanoparticles; saturated magnetization; spherical chitosan nanoparticles; superparamagnetism; transmission electron microscope; Iron; Nanoelectronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1572-4
  • Electronic_ISBN
    978-1-4244-1573-1
  • Type

    conf

  • DOI
    10.1109/INEC.2008.4585624
  • Filename
    4585624