Thermal Analysis of Novel Helix TWTs

Author

Yao, Lieming ; Yang, Zhonghai ; Li, Bin ; Liao, Li ; Zeng, Baoqing ; Zhu, Xiaofang

Author_Institution

Inst. of High Energy Electron., Univ. of Electron. Sci. & Technol. of China

fYear

0

fDate

0-0 0

Firstpage

139

Lastpage

140

Abstract

Consider the thermal contact resistance and the thermal conductivity as the function of temperature, the power dissipation of BeO and diamond-supported, the diamond-studded and the full-diamond helical slow-wave structures (HSWS) are computed using ANSYS. Results indicated the studded-diamond circuit is better than the diamond-support circuit. Especially, the full diamond circuit demonstrated advantage of excellent heat removing

Keywords

beryllium compounds; contact resistance; diamond; helical waveguides; slow wave structures; thermal analysis; thermal conductivity; BeO; diamond-support circuit; full diamond circuit; full-diamond helical slow-wave structures; helix travelling wave tubes; studded-diamond circuit; thermal analysis; thermal conductivity; thermal contact resistance; Circuit testing; Computational modeling; Conducting materials; Contact resistance; Copper; Electrical resistance measurement; Power dissipation; Temperature measurement; Thermal conductivity; Thermal resistance; ANSYS; TWT; diamond; thermal contact resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Vacuum Electronics Conference, 2006 held Jointly with 2006 IEEE International Vacuum Electron Sources., IEEE International

Conference_Location

Monterey, CA

Print_ISBN

1-4244-0108-9

Type

conf

DOI

10.1109/IVELEC.2006.1666223

Filename

1666223