DocumentCode
2373189
Title
Multicontact hybrid interconnection
Author
Karnaushenko, D.D. ; Lee, I.I. ; Karnaushenko, D.D.
Author_Institution
Inst. of Semicond. Phys., Siberian Branch of Russian Acad. of Sci., Novosibirsk
fYear
2008
fDate
1-5 July 2008
Firstpage
14
Lastpage
16
Abstract
The method of mechanical and electrical interconnection of functionality devices placed on the surfaces of different solid state materials by elastic strained films is described. Main advantages of the new method, in compare with the classical indium bump technique is shown.
Keywords
integrated circuit interconnections; micromechanical devices; nanocontacts; nanoelectronics; MEMS; elastic strained films; electrical interconnection; indium bump technique; mechanical interconnection; multicontact hybrid interconnection; solid state materials; Contacts; Cooling; Crystals; Detectors; Indium; Integrated circuit interconnections; Semiconductor materials; Substrates; Temperature; Thermal stresses; Contact; hybrid; micro cantilever; surface;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Materials, 2008. EDM 2008. 9th International Workshop and Tutorials on
Conference_Location
Novosibirsk
ISSN
1815-3712
Print_ISBN
978-5-7782-0893-3
Type
conf
DOI
10.1109/SIBEDM.2008.4585848
Filename
4585848
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