Carrier and socket technology for high pin count QFP packages

Author

Foerstel, Joseph

Author_Institution

Altera Corp., San Jose, CA, USA

fYear

1994

fDate

1-4 May 1994

Firstpage

828

Lastpage

832

Abstract

The Carrier and Socket Technology for high pin count Quad Flat Pack, QFP, packages is a set of three components, that can be used in various combinations, that allow for easier manipulation of fine pitch, (fine pitch defined as packages having a lead tip to lead tip spacing of .65 millimeters or less), QFP between various shipping, test, programming, and proto- typing environments. The three components are the small outline Carrier, surface mountable Development Socket, and through hole mountable Programming Socket. The Carrier is designed to protect the leads of the QFP from deformation, while allowing the leads to make electrical connection with the contacts of the two different sockets. The Development Socket is surface mountable with a footprint that is identical to the naked QFP housed within the Carrier. The Programming Socket is a through hole mountable, clam-shell socket, which accepts the same Carrier as the Development Socket

Keywords

electric connectors; fine-pitch technology; integrated circuit packaging; surface mount technology; QFP packages; carrier technology; clam-shell socket; electrical connection; fine pitch; high pin count; prototyping environments; small outline carrier; socket technology; surface mountable development socket; through hole mountable programming socket; Circuit testing; Contacts; Electronics packaging; Foot; Plastics; Printed circuits; Programming environments; Protection; Prototypes; Sockets;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367533

Filename

367533