• DocumentCode
    2376406
  • Title

    Bilaterally Metal-loaded Tri-plate Transmission Line with Loss-reduced Holes as a Low-loss and Low-cost Printed Transmission Lines at Millimeter-wavelengths

  • Author

    Tamaru, Ryo-ji ; Kuroki, Futoshi

  • Author_Institution
    Kure Nat. Coll. of Technol., Hiroshima
  • fYear
    2008
  • fDate
    27-31 Oct. 2008
  • Firstpage
    1265
  • Lastpage
    1268
  • Abstract
    Since surfaces of dielectric substrates for printed boards are usually roughened to make tight copper-coating, it was found out that an effective conductivity of a surface of the copper foil, attaching on the dielectric substrate, more degraded than that of an opposite surface of the copper foil, facing an air region, beyond centimeter frequencies. The transmission loss therefore degrades due to the roughness of the copper foil surface. On the other side, it is confirmed that the current density on the under surface of the copper foil decreases by symmetrically-loading metal patterns on both sides of the dielectric substrate and by biasing an equi-voltage to both metal patterns, and thus the transmission loss is relatively unaffected by the roughness of the dielectric surfaces. Based on this consideration, a bi-laterally metal-loaded tri-plate transmission line was evaluated by using a cheap FR-4 substrate, being poor material for use as millimeter-wave lengths but being cost-effective.
  • Keywords
    current density; printed circuits; surface roughness; transmission lines; FR-4 substrate; bilaterally metal-loaded tri-plate transmission line; dielectric substrate; dielectric surfaces; loss-reduced holes; millimeter-wave lengths; millimeter-wavelengths; symmetrically-loading metal patterns; transmission loss; Conductivity; Copper; Degradation; Dielectric losses; Dielectric substrates; Joining processes; Propagation losses; Rough surfaces; Surface roughness; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2008. EuMC 2008. 38th European
  • Conference_Location
    Amsterdam
  • Print_ISBN
    978-2-87487-006-4
  • Type

    conf

  • DOI
    10.1109/EUMC.2008.4751692
  • Filename
    4751692