Process considerations in the fabrication of Teflon printed circuit boards

Teflon-based dielectric materials provide desirable electrical and mechanical properties when used as insulator materials for printed wiring boards (PWB´s). However, along with the significant performance and reliability advantages of these insulator materials for microwave and high speed digital applications, there are also significant processing challenges. This paper reviews the significant electrical and mechanical properties of Teflon-based packaging materials, and discusses the unique processing challenges encountered in the fabrication of Teflon printed circuit boards and modules. Key features of the IBM Microelectronics High Performance Carrier fabrication process are described as they relate to those challenges