Development of 0.45 mm thick Ultra-Thin Small Outline Package (UTSOP)

Author

Omi, Susumu ; Maruyama, Tomoyo ; Ishio, Toshiya ; Narai, Atsuya ; Sota, Yoshikl ; Toyosawa, Kenji ; Fujiita, K. ; Maeda, Takamicht

Author_Institution

VLSI Dev. Lab., Sharp Corp., Nara, Japan

fYear

1994

fDate

1-4 May 1994

Firstpage

498

Lastpage

505

Abstract

The authors developed an Ultra-Thin Small Outline Package (UTSOP) with a package thickness of 0.45 mm. In spite of the fact that it is a significant reduction relative to conventional TSOPs (1.0 mm thick), the inner leads of the lead frame can be bonded to the electrodes on the chip with gold wire as with a conventional plastic package. It is feasible since the lead that supports the chip through insulating tape (support lead) is placed on the top side of the chip. Establishing molding technology and overcoming problems such as warping of the package or chip during assembly were key points in the development of the UTSOP. The UTSOP retains the same level of reliability as a TSOP

Keywords

integrated circuit packaging; lead bonding; plastic packaging; 0.45 mm; Au; UTSOP; Ultra-Thin Small Outline Package; assembly; chip; electrodes; gold wire; insulating tape; lead bonding; lead frame; molding technology; plastic package; reliability; support lead; warping; Bonding; Electrodes; Gold; Insulation; Integrated circuit packaging; Lead; Packaging machines; Plastic packaging; Resins; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367547

Filename

367547