Thermal performance of the 28×28 mm QFP PowerQuad2

Author

Marrs, Robert C.

Author_Institution

Div. of MicroSyst., Amkor Electron. Inc., USA

fYear

1994

fDate

1-4 May 1994

Firstpage

429

Lastpage

441

Abstract

This paper summarizes the results of an extensive thermal evaluation of the 28×28 mm plastic QFP PowerQuad2 package. The work was performed using an advanced three dimensional finite element thermal modeling program to characterize the thermal performance. Included in the study is an analysis of the effects on thermal resistance of die size, airflow, power, printed circuit board (PCB) type, PCB size, PCB Effective Heatsink Area (called PEHA), and the number of package leads and bond wires. Data is also presented on the Ø_j-pcb (junction to PCB) thermal resistance values for various configurations of the package and PCB

Keywords

cooling; heat sinks; integrated circuit packaging; plastic packaging; thermal resistance; 28 mm; PCB size; QFP PowerQuad2; airflow; bond wires; die size; effective heatsink area; package leads; plastic package; printed circuit board type; thermal evaluation; thermal resistance; Bonding; Electronic packaging thermal management; Electronics packaging; Finite element methods; Plastic packaging; Power system management; Printed circuits; Thermal management; Thermal resistance; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1994. Proceedings., 44th

Conference_Location

Washington, DC

Print_ISBN

0-7803-0914-6

Type

conf

DOI

10.1109/ECTC.1994.367555

Filename

367555