• DocumentCode
    2377164
  • Title

    Low cost fiber in the loop (FITL) laser modules

  • Author

    Butrie, Timothy

  • Author_Institution
    Solid State Technol. Center, AT&T Bell Labs., Breinigsville, PA, USA
  • fYear
    1994
  • fDate
    1-4 May 1994
  • Firstpage
    303
  • Lastpage
    311
  • Abstract
    This paper reviews the challenges associated with the design and assembly of low cost, fiber in the loop (FITL) laser modules. The implementation of fiber in the subscriber loop requires low cost, reliable packaging of semiconductor lasers into laser modules. The laser module provides a means of coupling photons from the laser into an optical fiber which requires alignments with stringent micron level tolerances. These alignments must remain stable over the severe loop environment, including temperature conditions from -40°C to +85°C, for the lifetime of the module. The design of the laser module must also satisfy mechanical, thermal, and electrical constraints. All these issues must be addressed while balancing the design between performance and cost, with low cost being the major driver for FITL applications
  • Keywords
    optical fibre couplers; optical fibre subscriber loops; semiconductor device packaging; semiconductor lasers; -40 to 85 degC; FITL laser modules; cost; electrical constraints; fiber in the loop; mechanical constraints; micron level tolerances; optical fiber coupling; packaging; semiconductor lasers; subscriber loop; temperature conditions; thermal constraints; Assembly; Costs; Fiber lasers; Optical coupling; Optical design; Optical fiber subscriber loops; Semiconductor device packaging; Semiconductor device reliability; Semiconductor lasers; Subscriber loops;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1994. Proceedings., 44th
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-0914-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1994.367573
  • Filename
    367573