DocumentCode
2377164
Title
Low cost fiber in the loop (FITL) laser modules
Author
Butrie, Timothy
Author_Institution
Solid State Technol. Center, AT&T Bell Labs., Breinigsville, PA, USA
fYear
1994
fDate
1-4 May 1994
Firstpage
303
Lastpage
311
Abstract
This paper reviews the challenges associated with the design and assembly of low cost, fiber in the loop (FITL) laser modules. The implementation of fiber in the subscriber loop requires low cost, reliable packaging of semiconductor lasers into laser modules. The laser module provides a means of coupling photons from the laser into an optical fiber which requires alignments with stringent micron level tolerances. These alignments must remain stable over the severe loop environment, including temperature conditions from -40°C to +85°C, for the lifetime of the module. The design of the laser module must also satisfy mechanical, thermal, and electrical constraints. All these issues must be addressed while balancing the design between performance and cost, with low cost being the major driver for FITL applications
Keywords
optical fibre couplers; optical fibre subscriber loops; semiconductor device packaging; semiconductor lasers; -40 to 85 degC; FITL laser modules; cost; electrical constraints; fiber in the loop; mechanical constraints; micron level tolerances; optical fiber coupling; packaging; semiconductor lasers; subscriber loop; temperature conditions; thermal constraints; Assembly; Costs; Fiber lasers; Optical coupling; Optical design; Optical fiber subscriber loops; Semiconductor device packaging; Semiconductor device reliability; Semiconductor lasers; Subscriber loops;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location
Washington, DC
Print_ISBN
0-7803-0914-6
Type
conf
DOI
10.1109/ECTC.1994.367573
Filename
367573
Link To Document