DocumentCode
2377719
Title
An interface for numerical analysis of convective heat transfer from printed circuit boards
Author
Ma, Yidong
Author_Institution
Dept. of Mech. Eng., Portland State Univ., OR, USA
fYear
1994
fDate
1-4 May 1994
Firstpage
653
Lastpage
658
Abstract
A geometrically-based user interface has been developed as a preprocessor for a numerical model of convective heat transfer from printed circuit boards (PCB). The physical problem is specified in a natural way as a collection of the control parameters and the objects that exist within the computational domain. Complicated configurations of discrete electronic components on a circuit board is represented by several simple physical objects with specified boundary conditions and heat-generating status. No reference to node or element number is needed and the input order of the objects can be arbitrary. The preprocessor program automatically sorts the coordinates of each object, subdivides the computational domain, eliminates the redundant coordinates and generates an object grid system that is consistent with the physical configurations of PCBs. This three dimensional geometrically-based object grid system is integrated to the main analysis codes for solving flow and temperature distribution. The geometrically-based model specification provides the hooks for a graphical user interface (GUI) which could be added later
Keywords
circuit CAD; cooling; graphical user interfaces; packaging; printed circuit design; thermal analysis; boundary conditions; computational domain; convective heat transfer; discrete electronic components; flow distribution; geometrically-based user interface; graphical user interface; numerical analysis; object grid system; preprocessor program; printed circuit boards; temperature distribution; Boundary conditions; Electronic components; Graphical user interfaces; Grid computing; Heat transfer; Numerical analysis; Numerical models; Physics computing; Printed circuits; User interfaces;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 1994. Proceedings., 44th
Conference_Location
Washington, DC
Print_ISBN
0-7803-0914-6
Type
conf
DOI
10.1109/ECTC.1994.367602
Filename
367602
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