• DocumentCode
    2379471
  • Title

    Variation-aware thermal characterization and management of multi-core architectures

  • Author

    Kursun, Eren ; Cher, Chen-Yong

  • Author_Institution
    Thomas J. Watson Res. Center, IBM, Yorktown Heights, NY
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    280
  • Lastpage
    285
  • Abstract
    The accuracy and efficiency of dynamic power and thermal management are both affected by the increased levels of on-chip variation, mainly because dynamic thermal management schemes are oblivious to the variation characteristics of the underlying hardware. We propose a technique that utilizes the existing on-chip sensor infrastructure to improve the inherent thermal imbalances among different cores in a multi-core architecture. Thermal sensor readings are compiled to generate an on-chip variation map, which is provided to the system power/thermal management to effectively manage the existing on-chip variation. Experimental analysis based on live measurements on a special test-chip shows reduced on-chip heating with no performance loss, which improves the power/thermal efficiency of the chip at no cost.
  • Keywords
    heating; microprocessor chips; temperature sensors; thermal management (packaging); dynamic power; multicore architectures; on-chip heating; on-chip sensor infrastructure; on-chip variation; on-chip variation map; power efficiency; thermal efficiency; thermal sensor readings; variation-aware thermal characterization; variation-aware thermal management; Energy management; Hardware; Performance analysis; Power generation; Power system management; Sensor phenomena and characterization; Sensor systems; System-on-a-chip; Thermal management; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design, 2008. ICCD 2008. IEEE International Conference on
  • Conference_Location
    Lake Tahoe, CA
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4244-2657-7
  • Electronic_ISBN
    1063-6404
  • Type

    conf

  • DOI
    10.1109/ICCD.2008.4751874
  • Filename
    4751874