DocumentCode
2379731
Title
Effect of Gate Metal Electrode on Chemical Bonding State in Metal/Pr-Oxide/Ge Gate Stack Structure
Author
Kato, Kimihiko ; Sakashita, Mitsuo ; Takeuchi, Wakana ; Taoka, Noriyuki ; Nakatsuka, Osamu ; Zaima, Shigeaki
Author_Institution
Grad. Sch. of Eng., Nagoya Univ., Nagoya, Japan
fYear
2012
fDate
4-6 June 2012
Firstpage
1
Lastpage
2
Abstract
We investigated the effect of the oxidation-reduction character of metal electrode on the chemical bonding state in metal/Pr-oxide/Ge gate stack structure. The binding energy of the Pr-oxide peak increases with the formation of a metal electrode with the strong reduction character, indicating the change in the valence state of Pr from tetravalent to trivalent. The intensity of the Ge oxide peak changes depending on metal species. It is suggested that some amount of Ge oxide is reduced in the sample with the metal film with the strong reduction character. Therefore, the oxidation-reduction character of metal electrode affects on not only the change in the Pr valence state in oxide film but also the interfacial reaction at the Pr-oxide/Ge interface for metal/Pr-oxide/Ge gate stack structures. These results suggest that a selection of gate metal species with basing on an oxidation-reduction character is quite important since it affects not only the dielectric constant of high-k films but also the interfacial chemical bonding structures in metal/high-k/Ge gate stack structures.
Keywords
bonds (chemical); germanium; high-k dielectric thin films; oxidation; permittivity; praseodymium compounds; PrO-Ge; binding energy; chemical bonding state; dielectric constant; gate metal electrode; gate metal species; high-k films; interfacial chemical bonding structure; interfacial reaction; metal film; metal gate stack structure; oxidation-reduction character; valence state; Bonding; Chemicals; Electrodes; Films; Logic gates; Metals; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
Conference_Location
Berkeley, CA
Print_ISBN
978-1-4577-1864-9
Electronic_ISBN
978-1-4577-1863-2
Type
conf
DOI
10.1109/ISTDM.2012.6222461
Filename
6222461
Link To Document