• DocumentCode
    2380536
  • Title

    Stability of Tensile-Strained Ge Studied by Transmission Electron Microscopy

  • Author

    Qi, Meng ; Brien, William A O ; Stephenson, Chad A. ; Cao, Ning ; Thibeault, Brian J. ; Wistey, Mark A.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Notre Dame, Notre Dame, IN, USA
  • fYear
    2012
  • fDate
    4-6 June 2012
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    The sensitivity of strained Ge to damage after irradiation with 300kV electron-beam was studied. A time-dependent damage analysis under TEM irradiation on two 0.5 μm-width waveguides, one with 1 GPa stress and a 20 nm protection layer, the other with 2 GPa stress but no protection layer, was performed. The interface for highly-strained waveguides was severely damaged by e-beam within mere seconds, and the damage propagated into the deeper region with time. For the weakly strained sample, the weak damage was confined within 2 nm of the interface and did not propagate. Highly strained Ge interfaces were susceptible to damage, and the dislocations propagated deep into the waveguide.
  • Keywords
    deformation; dislocations; electron beam effects; elemental semiconductors; germanium; silicon compounds; transmission electron microscopy; Ge-SiNx; TEM; dislocations; electron-beam irradiation; highly-strained waveguides; sensitivity; size 20 nm; stress; tensile-strained interface; time-dependent damage analysis; transmission electron microscopy; Films; Laser theory; Optical waveguides; Photonic band gap; Stress; Tensile strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Silicon-Germanium Technology and Device Meeting (ISTDM), 2012 International
  • Conference_Location
    Berkeley, CA
  • Print_ISBN
    978-1-4577-1864-9
  • Electronic_ISBN
    978-1-4577-1863-2
  • Type

    conf

  • DOI
    10.1109/ISTDM.2012.6222505
  • Filename
    6222505