Thermal management of VCSEL-based optoelectronic modules

Author

Lee, Y.C. ; Swirhun, S.E. ; Fu, W.S. ; Keyser, T.A. ; Jewell, J.L. ; Quinn, W.E.

Author_Institution

Center for Optoelectron. Comput. Syst., Colorado Univ., Boulder, CO, USA

fYear

1995

fDate

21-24 May 1995

Firstpage

387

Lastpage

392

Abstract

The development of reliable optoelectronic modules based on vertical-cavity surface-emitting lasers (VCSELs) will depend strongly on proper thermal management. One of the module´s critical thermal paths is from a VCSEL to a heat sink, which is affected by packaging technologies and materials. The measured VCSEL-to-case resistance of a laser with 8-μm aperture was 1650°C/Watt, and that of a 20-μm device was 1070°C/Watt. To study the packaging effects, a 3-D numerical model has been developed and calibrated by the measured data. The calibrated model was used to understand the difference in thermal behavior (1) between a wire-bonded and a flip-chip VCSEL module, (2) between a single-VCSEL and an 8×8-VCSEL module, and (3) between a bottom-cooled and an top-cooled module

Keywords

cooling; flip-chip devices; heat sinks; lead bonding; packaging; semiconductor laser arrays; surface emitting lasers; 20 micron; 3D numerical model; 8 micron; VCSEL-based optoelectronic modules; VCSEL-to-case resistance; bottom-cooled module; critical thermal paths; flip-chip module; heat sink; packaging technologies; thermal management; top-cooled module; vertical-cavity surface-emitting lasers; wire-bonded module; Apertures; Electrical resistance measurement; Heat sinks; Laser modes; Optical materials; Packaging; Surface emitting lasers; Surface resistance; Thermal management; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.515309

Filename

515309